1968  Material Engineering, Osaka Univ. Japan
  NEC IC Div. 
  Invented Au Superfine-wiring technology, which is current defact-standard, for Automatic LSI bonder machine  
   1992  Director of NEC Packaging Technology Research Gr.
Developed TAB technology for super computer, and TCP technology for consumer electronics. 
   1994 Project Director of NEC New Packaging Technology Research Gr. Developed Bearchip MCM Tech (LLC Tech) for Note PC & PDA, and Accumulated Memory Packaging Tech for Aero-Space ALOS Recorder
   1999  Director of Electronics System Integration Technology Research Department
National Project : Association of Super-Advanced Electronics Technologies (ASET)
   2004  ZyCube President / CEO
Technical Advisor of ASE

  1992-2002  JIEP
  1999-2004 The Electronics and related Industries Committee of the Electronics System Integration Advanced Techinical Promontory
  2002- Member of ECS-ISTC

   1974  Doctor of Electronic Engineering, Tohoku Univ. Japan
Hitachi Ltd., Research Center

Researched DRAM process/Device Tech.
Invented Stacked Capacitor DRAM.
  1985  Xerox Palo Alto Research Center
Researched sub-micron device, TFT, and digital/analog LSI advanced design
  1988  Professor of Integrated System Research Center, Hiroshima Univ.
Researched Superfine Semiconductor device, ALIC, optical interconnection and so on
  1994 Professor of Intelligent Machine Engineering, Tohoku Univ.
  1995  Professor of Intelligent Machine Engineering,
Graduate School, Tohoku Univ.
Chairman of Venture Lab, Tohoku Univ.
Researching 3D LSI Tech.
  2003 Professor of Bioengineering and Robotics,
Graduate School of Engineering, Tohoku Univ.
  2004 ZyCube CTO

  1992 SSDM Award
  1996 IEEE Cledo Brunetti Award  
  1997 IEEE Fellow Award  
  2002 Minister of Science and Technology Agency Award  
  2006 IEEE Jun-ichi Nishizawa Medal  

  "Physics of VLSI Device" (Maruzen)  
"Sub-micron Technology I, II" (Maruzen)